環球網

三星电子设备解决方案DS）部门已着手开发下一代封装材料“玻璃中介层”，目标不仅是取代昂贵的硅中介层，还要提升芯片性能。据报导，三星电子最近收到澳洲材料商Chemtronics和南韩设备商Philopt

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（书院总院）责编 吴斌